L24HIR83233-30/a-pf a 01-dec. data sheet L24HIR83233-30/a-pf infrared emitting diodes ligitek electronics co.,ltd. property of ligitek only pb lead-free parts doc. no : qw0905- rev. : date : - 2014 l dcc
t-1 3/4 package individually part no. infrared emitting diodes encapsulated in water clear plastic the L24HIR83233-30/a-pfseries are high power solution grown efficiency descriptions: 3. low average degradation. 2. suitable for pulsed applications. 1. high radiant intensity. features: device selection guide: note : 1.all dimension are in millimeter tolerance is L24HIR83233-30/a-pf ligitek electronics co.,ltd. property of ligitek only page1/9 gallium arsenide 1.5max 11.0 1.0min 2.54typ
note : 1.the forward voltage data did not including ? v v 1 100 ratings hir a ma unit page2/9 L24HIR83233-30/a-pf part no.
42 35 a14 35 29 a13 29 24 a12 24 20 a11 ligitek electronics co.,ltd. property of ligitek only group radiant intensity(mw/sr)at 20 ma max. min. brightness code for standard led lamps bin code 3/9 page L24HIR83233-30/a-pf part no. a15 42 50 a16 50 60 hir chip
fig.3 relative radiant power vs. forward dc current fig.5 forward dc voltage vs. temperature i fdc [ma] f o r w a r d d c v o l t a g e n o r m a l i z e @ 2 0 m a , 2 5 [ ] r e l a t i v e r a d i a n t p o w e r n o r m a l i z e @ 2 0 m a fig.4 relative radiant power i fpk [ma] r e l a t i v e r a d i a n t p o w e r n o r m a l i z e @ 1 0 0 m a typical electro-optical characteristics curve forward voltage[v] fig.1 forward current vs. rorward voltage f o r w a r d c u r r e n t [ m a ] wavelength[nm] fig.2 relative radiant power vs. wavelength r e l a t i v e r a d i a n t p o w e r n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only hir chip 0.01.02.03.04.0 0.1 1 10 100 1000 10 0.1 1 0.1 -40 0.8 -40 0.0 r e l a t i v e r a d i a n t p o w e r n o r m a l i z e @ 2 0 m a , 2 5
cleaning: use alcohol-based cleaning solvents such as isopropyl alcohol to clean the led. esd(electrostatic discharge): static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. storage time: 1.the operation of temperatures and rh are : 5 ?
2. the led lamps are designed for high-density mount- ing and have a structure which can alleviate mechan- ical stress due to clinching . nevertheless , take care to avoid the occurrence of residual mechanical stress due to clinching . 45
note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. dip soldering preheat: 120 50 60 seconds max 0 0 25 120 260 100 260 150 ligitek electronics co.,ltd. property of ligitek only page7/9 part no. L24HIR83233-30/a-pf
the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 1.ta=105
packing specification 1.250 pcs / bag w 3. 12 inner boxes / carton size : l x w x h 58.5cm x 34cm x 34cm 2. 8 bag / inner box size : l x w x h 33.5cm x 19cm x 7.5cm w h c/no: made in china i t e m n o . q ' t y : p c s n , w , : k g s g , w , : k g s l l h page9/9
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